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LED Industry Spare parts

  • Case

    Additional information

    Material

    Ceramic

    Process

    ICP

  • Chamber Wall Liner

    Additional information

    Material

    Metal

    Process

    Etch

  • Disk( SIC coating on surface)

    Additional information

    Material

    Graphite

    Process

    MOCVD

  • Flow channel

    Additional information

    Material

    Quartz

    Process

    MOCVD

  • Flow channel base

    Additional information

    Material

    Quartz

    Process

    MOCVD

  • Plate

    Additional information

    Material

    Ceramic

    Process

    ICP

  • Substrate holder

    Additional information

    Material

    Ceramic

    Process

    ICP

  • Substrate(SIC coating on surface)

    Additional information

    Material

    Graphite

    Process

    MOCVD

  • Suscepter( SIC coating on surface)

    Additional information

    Material

    Graphite

    Process

    MOCVD

  • Tray

    Additional information

    Material

    SiC

    Process

    ICP

  • Tray

    Additional information

    Material

    Quartz

    Process

    MOCVD

  • Tray

    Additional information

    Material

    Quartz

    Process

    MOCVD

Product Info

Contact

曾俊翔 Paulson Tseng

TEL : (03) 564-1224 ext.1606
Email : Paulson.tseng@tteam.com.tw