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Semiconductor Industry

  • 12″ Ceramic Robot Blade

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    Material

    Ceramic

  • 300 mm RTP WINDOW

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    Material

    Quartz

    Process

    Diffusion

  • Alumina oxide Robot Blade

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    Material

    Alumina

  • Alumina Robot Blade

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    Material

    Alumina

  • Anodize

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  • Anodize

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  • Anodize

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  • Baffle Plate

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    Material

    Si

  • Bell Jar

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    Material

    Quartz

  • Ceramic Carrier

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    Material

    Ceramic

  • Ceramic Coated ESC

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  • Ceramic coated Treatment

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  • Ceramic coating Telfon Robot Blade

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    Material

    Ceramic

  • Ceramic Robot Blade

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    Material

    Ceramic

  • Chamber Wall Liner

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    Material

    Metal

    Process

    Etch

  • CLR Lower Shield

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    Material

    Metal

  • CLR Upper Shield

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    Material

    Metal

  • Collimator

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    Material

    Metal

  • Coupling Ring

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    Material

    Quartz

  • DEPO Shield Ring

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    Material

    Metal

  • Door

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    Material

    Graphite

  • Electrode

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    Material

    Si

  • Electrode Ground

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    Material

    Graphite

  • Front Plate

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    Material

    Graphite

  • Gas injector

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    Material

    Quartz

  • Ground Ring

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    Material

    Quartz

  • Insert

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    Material

    Graphite

  • Insert Ring

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    Material

    Si

  • Insulator Back

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    Material

    Ceramic

  • Insulator Bottom

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    Material

    Ceramic

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